The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 bln in 2007 and grow to $20.2 bln by 2011, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $6.2 bln globally in 2007, and on a unit basis are projected to grow at a compound annual growth rate of over 12% over the next five years.